Display apparatus including an insulating material and heat transfer particles

ABSTRACT

Provided is a display apparatus including a display panel, a covering member, and an intermediate member. The intermediate member includes a base material including an insulating material and a heat transfer particle, and is disposed between the display panel and the covering member The display panel includes: a substrate; an encapsulation member which faces the substrate; and a display device which is arranged between the substrate and the encapsulation member and displays an image, the covering member is arranged to face the display panel, and the intermediate member is disposed in a gap between the covering member and an area of the substrate where the encapsulation member is not disposed.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a Continuation of U.S. patent application Ser. No.14/638,641, filed on Mar. 4, 2015, and claims priority from and thebenefit of Korean Patent Application No. 10-2014-0117024, filed on Sep.3, 2014, which is hereby incorporated by reference for all purposes asif fully set forth herein.

BACKGROUND Field

One or more embodiments of the present invention relate to a displayapparatus.

Discussion of the Background

Display apparatuses are one type of popular consumer electronic devices.In particular, as the size of display apparatuses become smaller andhave thinner thickness and light weight, users' usage range of variousdisplay devices has been widened. For some display devices, aself-emissive display apparatus which consumes lower power and has goodviewing angles and definition has been adopted.

Display apparatuses generally include a display panel including adisplay device configured to display an image for a user.

Display apparatuses may further include a covering member in order toprotect the display panel and improve the durability and userconvenience.

A stable connection of the display panel and the covering member mayaffect the entire durability of the display apparatuses.

Also, heat generated from display apparatuses may affect the electricalproperties of the display apparatuses, and thus the heat needs to beeffectively emitted.

The above information disclosed in this Background section is only forenhancement of understanding of the background of the inventive concept,and, therefore, it may contain information that does not form the priorart that is already known in this country to a person of ordinary skillin the art.

SUMMARY

One or more embodiments of the present invention include a displayapparatus having improved durability and electrical properties.

Additional aspects will be set forth in part in the description whichfollows and, in part, will be apparent from the description, or may belearned by practice of the presented embodiments.

According to one or more embodiments of the present invention, a displayapparatus which improves durability and electrical properties may beprovided.

According to one or more embodiments of the present invention, a displayapparatus includes: a display panel, a covering member, and anintermediate member. The intermediate member includes a base materialincluding an insulating material and a heat transfer particle, and theintermediate member is disposed between the display panel and thecovering member. The display panel includes: a substrate; anencapsulation member which faces the substrate; and a display devicearranged between the substrate and the encapsulation member. Thecovering member is arranged to face the display panel, and theintermediate member is disposed in a gap between the covering member andan area of the substrate where the encapsulation member is not disposed.

According to one or more embodiments of the present invention, a displayapparatus including: a display panel including one or more displaydevices to display an image to a user; a covering member arranged toface the display panel; a bonding member to bond the display panel andthe covering member, the bonding member being arranged between thedisplay panel and the covering member; and an intermediate memberdisposed in a gap between the display panel and the covering memberwhere the bonding member is not arranged, the intermediate memberincluding a base material including an insulating material and a heattransfer particle.

According to one or more embodiments of the present invention, a displayapparatus comprising: a display panel; an encapsulation member disposedon a first portion of a surface of the display panel; a layer disposedon a first portion of a surface of the encapsulation member; a coveringmember disposed on the layer, the covering member having a surface widerthan the surface of the encapsulation member; and an intermediate membercomprising a base material comprising an insulating material and a heattransfer particle, the intermediate member disposed between the displaypanel and the covering member. The intermediate member is disposed on asecond portion of the surface of the display panel and a second portionof the surface of the encapsulation member

The foregoing general description and the following detailed descriptionare exemplary and explanatory and are intended to provide furtherexplanation of the claimed subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the inventive concept, and are incorporated in andconstitute a part of this specification, illustrate exemplaryembodiments of the inventive concept, and, together with thedescription, serve to explain principles of the inventive concept.

FIG. 1 is a schematic cross-sectional view of a display apparatusaccording to an exemplary embodiment of the present invention.

FIG. 2 is an enlarged diagram of an area A of FIG. 1.

FIGS. 3 and 4 illustrate modified examples of FIG. 2.

FIG. 5 is an enlarged diagram of an area B of FIG. 1.

FIG. 6 is a schematic plan view of a display apparatus according to anexemplary embodiment of the present invention.

FIG. 7 is a cross-sectional view taken along a line VII-VII of FIG. 6.

FIG. 8 illustrates that a covering member of FIG. 6 is removed.

FIG. 9 is a schematic plan view of a display apparatus according to anexemplary embodiment of the present invention.

FIG. 10 is a schematic plan view of a display apparatus according to anexemplary embodiment of the present invention.

FIG. 11 is an enlarged diagram of an area K of FIG. 10.

FIG. 12 is a schematic plan view of a display apparatus according to anexemplary embodiment of the present invention.

FIG. 13 is a cross-sectional view taken along a line XIII-XIII of FIG.12.

FIG. 14 is a cross-sectional view taken along a line XIV-XIV of FIG. 12.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

As the invention allows for various changes and numerous embodiments,particular embodiments will be illustrated in the drawings and describedin detail in the written description. The attached drawings forillustrating exemplary embodiments of the present invention are referredto in order to gain a sufficient understanding of the present invention,the merits thereof, and the objectives accomplished by theimplementation of the present invention. The invention may, however, beembodied in many different forms and should not be construed as beinglimited to the embodiments set forth herein.

While such terms as “first”, “second”, etc., may be used to describevarious components, such components must not be limited to the aboveterms. The above terms are used only to distinguish one component fromanother.

An expression used in the singular encompasses the expression of theplural, unless it has a clearly different meaning in the context.

It will be further understood that the terms “comprises” and/or“comprising” used herein specify the presence of stated features orcomponents, but do not preclude the presence or addition of one or moreother features or components.

It will be understood that when a layer, region, or component isreferred to as being “formed on” another layer, region, or component, itcan be directly or indirectly formed on the other layer, region, orcomponent. That is, for example, intervening layers, regions, orcomponents may be present.

Sizes of components in the drawings may be exaggerated for convenienceof explanation. In other words, since sizes and thicknesses ofcomponents in the drawings are arbitrarily illustrated for convenienceof explanation, the following embodiments are not limited thereto.

In the following examples, the x-axis, the y-axis and the z-axis are notlimited to three axes of the rectangular coordinate system, and may beinterpreted in a broader sense. For example, the x-axis, the y-axis, andthe z-axis may be perpendicular to one another, or may representdifferent directions that are not perpendicular to one another.

When a certain embodiment may be implemented differently, a specificprocess order may be performed differently from the described order. Forexample, two consecutively described processes may be performedsubstantially at the same time or performed in an order opposite to thedescribed order.

The present invention will now be described more fully with reference tothe accompanying drawings, in which exemplary embodiments of theinvention are shown.

Like reference numerals in the drawings denote like elements, and thustheir description will be omitted.

FIG. 1 is a schematic cross-sectional view of a display apparatus 100according to an exemplary embodiment of the present invention, and FIG.2 is an enlarged diagram of an area A of FIG. 1.

Referring to FIG. 1 and FIG. 2, the display apparatus 100 includes adisplay panel 110, an intermediate member 120, and a covering member190.

The display panel 110 includes a substrate 101, an encapsulation member102, and a display device (not shown), and the intermediate member 120includes a base material 121 and heat transfer particles 122.

The display panel 110 may include one or more display devices in orderto display an image to a user. For example, the display panel 110 mayinclude a display device, such as an organic light-emitting device or aliquid crystal display device. The display panel 110 may include variousdisplay devices other than the above-listed display devices.

The display device of the display panel 110 will be described withreference to FIG. 5.

The substrate 101 may be formed of various materials. For example, thesubstrate 101 may be formed of a glass material which mainly containssilicon dioxide (SiO₂). Also, the substrate 101 may be formed of aflexible material, for example, flexible plastics. As a selectiveexample, the substrate 101 may include metals.

The encapsulation member 102 may be arranged to face the substrate 101.The encapsulation member 102 may include the same materials included inthe substrate 101, for example, a glass material which mainly containsSiO₂.

As a selective example, the encapsulation member 102 may include a thinfilm or a film-type thin film. For example, the encapsulation member 102may include one or more organic layers or one or more inorganic layers.Further, the encapsulation member 102 may have a structure in which oneor more organic layers and one or more inorganic layers are alternatelystacked at least one time.

Although not illustrated, a sealing member (not shown) may be arrangedto bond the substrate 101 and the encapsulation member 102. The sealingmember may be, for example, arranged around the display device (notshown) arranged between the substrate 101 and the encapsulation member102 and may bond the substrate 101 and the encapsulation member 102 toeach other.

As a selective example, the encapsulation member 102 may not cover aportion of a surface of the substrate 101. More specifically, a portionof a surface of the substrate 101 may not be covered by theencapsulation member 102 and may be exposed to the outside. For example,the encapsulation member 102 may be smaller than the substrate 101.

As a selective example, the encapsulation member 102 may have a smallerarea than that of the substrate 101.

As a selective example, the display panel 110 may include a touchpattern (not shown) which embodies a touch detection function.

The covering member 190 may be arranged on an upper surface of thedisplay panel 110. As a selective example, the covering member 190 maybe arranged to face the encapsulation member 102 of the display panel110.

The covering member 190 prevents the display panel 110 from beingdamaged due to external forces or impacts and improves the durability ofthe display panel 110. The covering member 190 may be formed of variousmaterials, for example, glass materials or plastics. As a selectiveexample, if light emitted by the display panel 110 needs to betransmitted to the user through the covering member 190, the coveringmember 190 may be formed of light-transmissive materials.

As a selective example, a bonding member 140 may be arranged between thecovering member 190 and the display panel 110. For example, the bondingmember 140 may be arranged between the covering member 190 and theencapsulation member 102.

The bonding member 140 bonds the covering member 190 and the displaypanel 110 to each other. For example, the bonding member 140 may includevarious bonding materials. As a selective example, the bonding member140 may include an organic material, for example, a resin-based bondingmaterial.

As a selective example, the bonding member 140 may be formed by forminga liquid resin or flexible resin material between the covering member190 and the display panel 110.

As a selective example, a polarization member 130 may be furtherarranged between the display panel 110 and the covering member 190. Forexample, the polarization member 130 may be arranged between the bondingmember 140 and the display panel 110. The polarization member 130improves properties of visible rays emitted by the display panel 110,changes the visible rays emitted by the display panel 110 to make theuser recognize light, or may improve a definition property of thedisplay apparatus 100 by decreasing or preventing the reflection ofexternal light in the display panel 110.

The intermediate member 120 includes the base material 121 and the heattransfer particles 122. The intermediate member 120 may be arrangedbetween an area of the substrate 101 of the display panel 110, which isnot covered by the encapsulation member 102, and the covering member190.

As a selective example, the intermediate member 120 may be arrangedbetween the covering member 190 and an area of the encapsulation member102, which is not covered by the bonding member 140 or the polarizationmember 130. In this case, the intermediate member 120 may be arranged tocontact sides of the encapsulation member 102, and the durability of thedisplay panel 110 may be enhanced by adhering the intermediate member120 to the encapsulation member 102.

As a selective example, the intermediate member 120 may be arranged onan area where the display panel 110 is bonded to the covering member 190from among areas disposed between the display panel 110 and the coveringmember 190. The intermediate member 120 may be arranged on an area otherthan an area where the bonding member 140 is arranged as shown in FIG.1, for example.

The intermediate member 120 may be arranged in a space between thedisplay panel 110 and the covering member 190, and as a selectiveexample, the intermediate member 120 may fill the space between thedisplay panel 110 and the covering member 190.

The intermediate member 120 may have a form in which the base material121 is mixed with the heat transfer particles 122. The base material 121may include various insulating materials. As a selective example, thebase material 121 may include organic materials. For example, the basematerial 121 may include a resin-based material. The base material 121may be arranged between the display panel 110 and the covering member190 so that the base material 121 may prevent the display panel 110 andthe covering member 190 from being damaged by an external impact. Inparticular, if the substrate 101 has a larger area than theencapsulation member 102, when the base material 121 fills the spacebetween the covering member 190 and an area of the substrate 101, whichdoes not correspond to the encapsulation member 102, the overalldurability of the display apparatus 100 may be improved.

The plurality of heat transfer particles 122 may be arranged in the basematerial 121 and may be formed of materials having a good heat transferproperty. The heat transfer particles 122 may include metals orcarbon-based materials. For example, the heat transfer particles 122 mayinclude copper (Cu). As another example, the heat transfer particles 122may include graphite.

The heat transfer particles 122 are arranged in the base material 121and may effectively emit heat generated in the display apparatus 100, inparticular, in the display panel 110. Through the effective emission ofthe heat, a possibility of an abnormal operation of the display panel110 may be reduced or controlled, thereby improving the electricalproperties or definition properties of the display apparatus 100.

Shapes of the heat transfer particles 122 may vary. In FIG. 2, the heattransfer particles 122 have a cross-section which is similar to acircle, and the heat transfer particles 122 may have a shape similar toa sphere.

The heat transfer particles 122 may have different shapes. FIGS. 3 and 4illustrate modified examples of FIG. 2; however, aspects of the presentinvention are not limited as such.

As shown in FIG. 3, an intermediate member 120′ as a modified exampleincludes a base material 121′ and heat transfer particles 122′, and theheat transfer particles 122′ may have an oval-shape according to across-sectional view.

Also, as shown in FIG. 4, an intermediate member 120″ as anothermodified example includes a base material 121″ and heat transferparticles 122″. The heat transfer particles 122″ may have a circle shapeas a cross-sectional view thereof and the heat transfer particles 123″may have an oval shape as a cross-sectional view thereof.

Although not illustrated, the heat transfer particles 122 may havevarious shapes, e.g., a pillar shape, a polygonal shape, a tube shape, achip shape, etc.

Referring to FIG. 5, the display device included in the display panel110 will be described. FIG. 5 is an enlarged diagram of an area B ofFIG. 1.

As described above, the display panel 110 may include the display devicearranged between the substrate 101 and the encapsulation member 102, andtypes of the display device may vary.

With regard to FIG. 5, an organic light-emitting device 150 will bedescribed as the display device. However, other display devices otherthan the organic light-emitting device 150 may be used. For example, thedisplay panel 110 may include at least one display device including aliquid crystal display device.

Referring to FIG. 5, the organic light-emitting device 150 may bearranged between the substrate 101 and the encapsulation member 102.

The organic light-emitting device 150 includes a first electrode 151, asecond electrode 152, and an intermediate layer 153.

Although not illustrated, a buffer layer (not shown) may be furtherformed or disposed on the first electrode 151 and the substrate 101. Thebuffer layer (not shown) provides a plane on the substrate 101 and mayprevent gases or moisture from penetrating through the substrate 101.

The first electrode 151 functions as an anode, and the second electrode152 functions as a cathode. However, polarities thereof may be switched.

If the first electrode 151 functions as an anode, the first electrode151 may include indium tin oxide (ITO), indium zinc oxide (IZO), zincoxide (ZnO), indium oxide (In₂O₃), or the like, which has a high workfunction. Also, according to an object and design conditions, the firstelectrode 151 may further include a reflective film formed of silver(Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold(Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium(Li), ytterbium (Yb), calcium (Ca) or the like.

If the second electrode 152 functions as a cathode, the second electrode152 may include metals, such as Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr,Li, or Ca. Also, the second electrode 152 may include ITO, IZO, ZnO,In₂O₃, or the like, in order to enable light transmission.

The intermediate layer 153 may include an emission layer in order toemit visible rays. For example, the intermediate layer 153 includes anorganic emission layer and may selectively include at least one of ahole injection layer, a hole transport layer, an electron transportlayer, and an electron injection layer in addition to the organicemission layer.

When a voltage is applied to the first electrode 151 and the secondelectrode 152, visible rays are emitted from the intermediate layer 153,in particular, the emission layer of the intermediate layer 153.

Although not illustrated, the display panel 110 may include one or morethin film transistors (TFTs) (not shown), which are electricallyconnected to the organic light-emitting device 150. Also, the displaypanel 110 may include one or more capacitors, which are electricallyconnected to the organic light-emitting device 150.

The display apparatus 100 may include an intermediate member 120 betweenthe display panel 110 and the covering member 190. Since theintermediate member 120 is arranged between the display panel 110 andthe covering member 190, damage to the display panel 110 and thecovering member 190 due to external impact may be prevented or reduced.In particular, the substrate 101 may have a larger area than theencapsulation member 102 so that a space exists between the coveringmember 190 and the substrate 101 as shown in FIG. 1. The space betweenthe substrate 101 and the covering member 190 where the encapsulationmember 102 is not disposed may be filled with the base material 121 toimprove the overall durability of the display apparatus 100.

Also, the intermediate member 120 may include the heat transferparticles 122 and may more effectively emit heat generated by thedisplay panel 110 to the outside. Thus, a possibility of an abnormaloperation of the display panel 110 may be reduced or controlled, therebyimproving the electrical properties or definition properties of thedisplay apparatus 100.

FIG. 6 is a schematic plan view of a display apparatus 200 according toan exemplary embodiment of the present invention, and FIG. 7 is across-sectional view taken along a line VII-VII of FIG. 6. FIG. 8illustrates that a covering member 290 of FIG. 6 is removed.

Referring to FIG. 6 through FIG. 8, the display apparatus 200 includes adisplay panel 210, an intermediate member 220, and the covering member290. For conciseness, differences between the examples illustrated inFIG. 6 through FIG. 8 and the above-described examples illustrated inthe preceding figures, e.g., FIG. 1 to FIG. 5 will be described in moredetail, and the description of the same features therebetween may beomitted.

The display panel 210 includes a substrate 201, an encapsulation member202, and a display device (not shown), and the intermediate member 220includes a base material 221, and heat transfer particles 222.

The display panel 210 may include one or more display devices in orderto display an image to a user. For example, the display panel 210 mayinclude display devices, such as an organic light-emitting device or aliquid display device. The display panel 210 may include various displaydevices other than the above-listed display devices. Also, the displaypanel 210 may include the organic light-emitting device 150 of FIG. 5.

The covering member 290 may be arranged on the display panel 210. As aselective example, the covering member 290 may be arranged to face theencapsulation member 202 of the display panel 210.

As a selective example, a bonding member 240 may be arranged between thecovering member 290 and the display panel 210. For example, the bondingmember 240 may be arranged between the covering member 290 and theencapsulation member 202.

As shown in FIG. 8, the intermediate member 220 may extend to correspondto an edge of the substrate 201, e.g., a left edge thereof. Also, as aselective example, the intermediate member 220 may contact the bondingmember 240. More specifically, sides of the intermediate member 220 maycontact an adhesive of the bonding member 240.

Thus, a gap between the display panel 210 and the covering member 290 isreduced, and the durability of the display apparatus 200 may beimproved.

As a selective example, a polarization member 230 may be furtherarranged between the display panel 210 and the covering member 290, andfor example, the polarization member 230 may be arranged between thebonding member 240 and the display panel 210.

The intermediate member 220 includes the base material 221 and the heattransfer particles 222. The intermediate member 220 may be arrangedbetween the covering member 290 and an area of the substrate 201 of thedisplay panel 210, which is not covered by the encapsulation member 202.

As a selective example, the intermediate member 220 may be arrangedbetween the covering member 290 and an area of the encapsulation member202, which is not covered by the bonding member 240 or the polarizationmember 230.

As a selective example, the intermediate member 220 may be arranged onan area where the display panel 210 is bonded to the covering member 290from among areas disposed between the display panel 210 and the coveringmember 290. More specifically, the intermediate member 200 may bedisposed, between the covering member 290 and an area of theencapsulation member 202, on an area other than an area where thebonding member 240 is arranged.

The intermediate member 220 may be arranged on a space between thedisplay panel 210 and the covering member 290, and as a selectiveexample, the intermediate member 220 may fill the space between thedisplay panel 210 and the covering member 290.

The base material 221 and the heat transfer particles 222 of theintermediate member 220 may be the same as those described above withrespect to FIG. 1 to FIG. 5, and thus detailed descriptions thereof willbe omitted.

FIG. 9 is a schematic plan view of a display apparatus 300 according toan exemplary embodiment of the present invention.

Referring to FIG. 9, the display apparatus 300 includes a display panel310, an intermediate member 320, a covering member 390, an integratedcircuit (IC) 350, and a main circuit member 355. For conciseness,differences between the example illustrated in FIG. 9 and theabove-described examples illustrated in the preceding figures, e.g.,FIG. 1 to FIG. 8 will be described in more detail, and the descriptionof the same features therebetween may be omitted.

The display panel 310 includes a substrate 301, an encapsulation member302, and a display device (not shown), and the intermediate member 320includes a base material 321 and heat transfer particles 322.

The display panel 310 may include one or more display devices in orderto display an image to a user. For example, the display panel 310 mayinclude display devices, such as an organic light-emitting device or aliquid display device. The display panel 310 may include various displaydevices other than the above-listed display devices. Also, the displaypanel 310 may include the organic light-emitting device 150 of FIG. 5.

The covering member 390 may be arranged on the display panel 310. As aselective example, the covering member 390 may be arranged to face theencapsulation member 302 of the display panel 310.

As a selective example, a bonding member 340 may be arranged between thecovering member 390 and the display panel 310. For example, the bondingmember 340 may be arranged between the covering member 390 and theencapsulation member 302.

The IC 350 may be arranged on a first portion of a surface of thesubstrate 301 where the encapsulation member 302 is not disposed. Theencapsulation member 302 may be disposed on a second portion of thesurface of the substrate 301 so that the IC 350 and the encapsulationmember 302 are disposed on the same surface of the substrate 301 asshown in FIG. 9. The IC 350 may, for example, transmit, to the displaypanel 310, electrical signals necessary to operate the display panel 310of the display apparatus 300.

As a selective example, the main circuit member 355 may be electricallyconnected to the IC 350 disposed on the surface of the substrate 301. Anend of the main circuit member 355 is electrically connected to acircuit board (not shown). The main circuit member 355 receiveselectrical signals from the circuit board and may transmit the receivedelectrical signals to the IC 350. Also, the main circuit member 355 maytransmit the electrical signals to the circuit board.

As a selective example, the main circuit member 355 may include aflexible material. For example, the main circuit member 355 may be aflexible printed circuit (FPC). Further, the main circuit member 355 maybe a flexible printed circuit board (FPCB).

If the main circuit member 355 is configured to include a flexiblematerial, the main circuit member 355 may be curved so that an endthereof is arranged to face a surface opposite to the surface of thesubstrate 301 on which the encapsulation member 302 is disposed.

As shown in FIG. 9, the intermediate member 320 may cover the IC 350,and as a selective example, the intermediate member 320 may contact andsurround the exposed surfaces of the IC 350. Also, the intermediatemember 320 may cover an area of the main circuit member 355 whichcorresponds to at least the substrate 301 from among areas of the maincircuit member 355.

As a selective example, a polarization member 330 may be furtherarranged between the display panel 310 and the covering member 390, andfor example, the polarization member 330 may be arranged between thebonding member 340 and the display panel 310.

The intermediate member 320 includes the base material 321 and the heattransfer particles 322. The intermediate member 320 may be arrangedbetween the covering member 390 and an area of the substrate 301 of thedisplay panel 310, which is not covered by the encapsulation member 302.

As a selective example, the intermediate member 320 may be arrangedbetween the covering member 390 and an area of the encapsulation member302, which is not covered by the bonding member 340 and/or thepolarization member 330.

As a selective example, the intermediate member 320 may be arranged onan area where the display panel 310 is bonded to the covering member 390from among areas disposed to between the display panel 310 and thecovering member 390. More specifically, the intermediate member 320 mayfill the space between the display panel 310 and the covering member 390on an area other than an area where the bonding member 340 is arranged.

The intermediate member 320 may be arranged on a space between thedisplay panel 310 and the covering member 390, and as a selectiveexample, the intermediate member 320 may fill the space between thedisplay panel 310 and the covering member 390.

The base material 321 and the heat transfer particles 322 of theintermediate member 320 may be the same as those described above, e.g.,base materials 121, 121′ and 121″ and heat transfer particles 122, 122′,122″, and 123″, and thus detailed descriptions thereof will be omitted.

The intermediate member 320 may cover and protect the IC 350. Since theintermediate member 320 covers an area of the main circuit member 355which corresponds to the substrate 301 from among areas of the maincircuit member 355, the main circuit member 355 may be more stablyconnected to the substrate 301. The main circuit member 355 may bestably disposed on the substrate 301. Further, the main circuit member355 may be electrically connected to the IC 350.

Also, due to operation of the display panel 310, heat may be generatedby the IC 350 and the main circuit member 355. If the temperatures ofthe IC 350 and the main circuit member 355 exceed certain thresholds,electrical properties of the IC 350 and the main circuit member 355 maybe degraded or electrical defects may occur. The heat generated by theIC 350 and the main circuit member 355 may be effectively emittedthrough the heat transfer particles 322 of the intermediate member 320,and thus the electrical properties of the IC 350 and the main circuitmember 355 may be enhanced by the heat transfer particles 322 around theIC 350 and the main circuit member 355.

FIG. 10 is a schematic plan view of a display apparatus 400 according toan exemplary embodiment of the present invention, and FIG. 11 is anenlarged diagram of an area K of FIG. 10.

Referring to FIG. 10 and FIG. 11, the display apparatus 400 includes adisplay panel 410, an intermediate member 420, a covering member 490,and a circuit member 460 for touch input signals. For conciseness,differences between the examples illustrated in FIG. 6 through FIG. 8and the above-described examples illustrated in the preceding figureswill be described in more detail, and the description of the samefeatures therebetween may be omitted.

The display panel 410 includes a substrate 401, an encapsulation member402, and a display device (not shown), and the intermediate member 420includes a base material 421 and heat transfer particles 422.

The display panel 410 may include one or more display devices in orderto display an image to a user. For example, the display panel 410 mayinclude display devices, such as an organic light-emitting device or aliquid display device. The display panel 410 may include various displaydevices other than the above-listed display devices. Also, the displaypanel 410 may include the organic light-emitting device 150 of FIG. 5.

The covering member 490 may be arranged on the display panel 410. As aselective example, the covering member 490 may be arranged to face theencapsulation member 402 of the display panel 410.

As a selective example, a bonding member 440 may be arranged between thecovering member 490 and the display panel 410. For example, the bondingmember 440 may be arranged between the covering member 490 and theencapsulation member 402.

As shown in FIG. 10 and FIG. 11, a touch pattern 470 may be formed on asurface of the encapsulation member 402. In particular, the touchpattern 470 may be formed on a surface opposite to a surface which isclose to the substrate 401, that is, the upper surface of theencapsulation member 402.

Although not illustrated, as a selective example, the touch pattern 470may be formed on a lower surface of the encapsulation member 402.

As another selective example, the touch pattern 470 may be formed on asurface of the substrate 401 and may be formed between the substrate 401and the encapsulation member 402.

Although not illustrated, a separate panel including the touch pattern470 may be arranged adjacent to the display panel 410.

Forms of the touch pattern 470 may vary. For example, the touch pattern470 may include one conductive pattern. Further, as a selective example,the touch pattern 470 may include multiple conductive patterns. Also,the touch pattern 470 may include two or more conductive patterns thathave one or more insulating layers interposed therebetween.

The circuit member 460 may transmit electrical signals to the touchpattern 470. As a detailed example, the circuit member 460 receiveselectrical signals from a circuit (not shown), which may be arrangedoutside the display panel 410 and may transmit the received electricalsignals to the touch pattern 470.

More specifically, although not illustrated, the circuit member 460 maybe electrically connected to the touch pattern 470 through wires (notshown) or a conductive pattern (not shown).

The circuit member 460 may have various forms, and types of the circuitmember 460 may vary. As a selective example, the circuit member 460 mayinclude flexible materials. For example, the circuit member 460 may bean FPC. The circuit member 460 may be an FPCB.

If the circuit member 460 is flexible, the circuit member 460 may becurved so that an end thereof may be arranged to face a surface oppositeto the surface of the substrate 401 on which the encapsulation member402 is disposed.

The intermediate member 420 may cover an area of the circuit member 460which corresponds to the substrate 401 from among areas of the circuitmember 460, e.g., an area corresponding to an area disposed between thesubstrate 401 and the covering member 490 as shown in FIG. 10.

As a selective example, the intermediate member 420 may be arranged tosurround the circuit member 460 in part as shown in FIG. 10. Morespecifically, the intermediate member 420 may surrounds exposed surfacesof the circuit member 460 by disposing the intermediate member 420within the space between the substrate 401 and the covering member 490.

As a selective example, a polarization member 430 may be furtherarranged between the display panel 410 and the covering member 490. Forexample, the polarization member 430 may be arranged between the bondingmember 440 and the display panel 410.

The intermediate member 420 includes the base material 421 and the heattransfer particles 422. The intermediate member 420 may be arrangedbetween the covering member 490 and an area of the substrate 401 of thedisplay panel 410, which is not covered by the encapsulation member 402from among areas of the substrate 401 of the display panel 410.

As a selective example, the intermediate member 420 may be arrangedbetween the covering member 490 and an area of the encapsulation member402, which is not covered by the bonding member 440 or the polarizationmember 430.

As a selective example, the intermediate member 420 may be arranged onan area where the display panel 410 is not bonded to the covering member490 from among areas disposed between the display panel 410 and thecovering member 490. More specifically, between the covering member 490and the display panel 410, the intermediate member 420 may be disposedon an area except for an area where the bonding member 440 is arranged.

The intermediate member 420 may be arranged on a space between thedisplay panel 410 and the covering member 490, and as a selectiveexample, the intermediate member 420 may fill the space between thedisplay panel 410 and the covering member 490.

The base material 421 and the heat transfer particles 422 of theintermediate member 420 may be the same as those described above, e.g.,base materials 121, 121′ and 121″ and heat transfer particles 122, 122′,122″, and 123″, and thus detailed descriptions thereof will be omitted.

Since the intermediate member 420 covers an area of the circuit member460 which corresponds to the substrate 401 from among areas of thecircuit member 460, the circuit member 460 may be stably disposed on thesubstrate 401. As shown in FIG. 10, the intermediate member 420 maycover the area of the circuit member 460 located in the space betweenthe substrate 401 and the covering member 490. In particular, as aselective example, if the intermediate member 420 is arranged to fillthe space between the substrate 401 and the covering member 490, theintermediate member 420 adheres to the circuit member 460, and thedurability of the circuit member 460 may be improved.

Also, due to an operation of the circuit member 460, heat may begenerated by the circuit member 460. If the temperature of the circuitmember 460 exceeds a certain threshold, electrical properties of thecircuit member 460 may be degraded or electrical defects may occur. Theheat generated by the circuit member 460 may be effectively emittedthrough the heat transfer particles 422 of the intermediate member 420,and thus the electrical properties of the circuit member 460 may beenhanced.

FIG. 12 is a schematic plan view of a display apparatus 500 according toan exemplary embodiment of the present invention, FIG. 13 is across-sectional view taken along a line XIII-XIII of FIG. 12, and FIG.14 is a cross-sectional view taken along a line XIV-XIV of FIG. 12.

In FIG. 12, a plan view of the top surface of a covering member 590 isillustrated, and an intermediate member 520, an IC 550, and a circuitmember 560 for touch input signals, which are arranged on a lowersurface of the covering member 590, are indicated by dashed lines.

Referring to FIG. 12 to FIG. 14, the display apparatus 500 includes adisplay panel 510, the intermediate member 520, the covering member 590,the IC 550, a main circuit member 555, and the circuit member 560. Forconciseness, differences between the examples illustrated in FIG. 12through FIG. 14 and the above-described examples illustrated in thepreceding figures will be described in more detail, and the descriptionof the same features therebetween may be omitted.

The display panel 510 includes a substrate 501, an encapsulation member502, and a display device (not shown), and the intermediate member 520includes a base material 521 and heat transfer particles 522.

The display panel 510 may include one or more display devices in orderto display an image to a user. For example, the display panel 510 mayinclude display devices, such as an organic light-emitting device or aliquid display device. The display panel 510 may include various displaydevices other than the above display devices. Also, the display panel510 may include the organic light-emitting device 150 of FIG. 5.

The covering member 590 may be arranged on the display panel 510. As aselective example, the covering member 590 may be arranged to face theencapsulation member 502 of the display panel 510.

As a selective example, a bonding member 540 may be arranged between thecovering member 590 and the display panel 510. For example, the bondingmember 540 may be arranged between the covering member 590 and theencapsulation member 502.

As shown in FIG. 12 and FIG. 13, the intermediate member 520 may bedisposed such that an edge of the intermediate member 520 corresponds toan edge of the substrate 501. Also, as a selective example, theintermediate member 520 may contact the bonding member 540. Morespecifically, a side of the intermediate member 520 may contact thebonding member 540 as shown in FIG. 13.

Thus, a possibility of a gap between the display panel 510 and thecovering member 590 may be reduced, and the durability of the displayapparatus 500 may be improved.

The IC 550 may be arranged on a surface of the substrate 501. The IC 550may, for example, transmit, to the display panel 510, electrical signalsto operate the display panel 510 of the display apparatus 500.

As a selective example, the main circuit member 555 may be electricallyconnected to the IC 550 disposed on the surface of the substrate 501. Anend of the main circuit member 555 may be connected to a main circuitboard 557. The main circuit member 555 receives electrical signals fromthe main circuit board 557 and may transmit the received electricalsignals to the IC 550. Also, the main circuit member 555 may receiveelectrical signals from the IC 550 and may transmit the electricalsignals to the main circuit board 557.

As a selective example, the main circuit member 555 may include flexiblematerials. For example, the main circuit member 555 may be an FPC. Asanother example, the main circuit member 555 may be an FPCB.

In the case of the main circuit member 555 having flexibility, as shownin FIG. 13, the main circuit member 555 may be curved, and an endthereof may be arranged to face a surface opposite to the surface of thesubstrate 501 on which the encapsulation member 502 is disposed. Morespecifically, the main circuit board 557 may be arranged on a lowersurface of the substrate 501. A portion of the main circuit member 555is curved, and an end thereof may be connected to the main circuit board557 as shown in FIG. 13.

The intermediate member 520 may cover the IC 550. As a selectiveexample, the intermediate member 520 may contact the IC 550. Also, theintermediate member 520 may cover an area of the main circuit member 555which corresponds to at least the substrate 501 from among areas of themain circuit member 555.

A touch pattern (not shown) may be formed on a surface of theencapsulation member 502, e.g., an upper surface or a lower surface ofthe encapsulation member 502. As a selective example, the touch patternmay be formed on a surface of the encapsulation member 502 or may beformed between the substrate 501 and the encapsulation member 502.

Although not illustrated, a separate panel including the touch patternmay be arranged adjacent to the display panel 510.

The circuit member 560 may transmit electrical signals to the touchpattern. As a detailed example, the circuit member 560 receiveselectrical signals from a circuit board 567, which is arranged outsidethe display panel 510 and may transmit the received electrical signalsto the touch pattern.

Forms and types of the circuit member 560 may vary. As a selectiveexample, the circuit member 560 may include flexible materials. Forexample, the circuit member 560 may be an FPC. As another selectiveexample, the circuit member 560 may be an FPCB.

In the case of the circuit member 560 and having flexibility, thecircuit member 560 may be curved, and an end thereof may be arranged toface a surface opposite to the surface of the substrate 501 on which theencapsulation member 502 is disposed.

Specifically, the circuit board 567 may be arranged to correspond to thelower surface of the substrate 501, and the curved end of the circuitmember 560 may be connected to the circuit board 567.

The intermediate member 520 may cover an area of the circuit member 560which corresponds to at least the substrate 501 from among areas of thecircuit member 560.

As a selective example, the intermediate member 520 may be arranged tosurround the circuit member 560 to adhere to the circuit member 560.

As a selective example, a polarization member 530 may be furtherarranged between the display panel 510 and the covering member 590, andfor example, the polarization member 530 may be arranged between thebonding member 540 and the display panel 510.

The intermediate member 520 includes the base material 521 and the heattransfer particles 522. The intermediate member 520 may be arrangedbetween the covering member 590 and an area of the substrate 501 of thedisplay panel 510, which is not covered by the encapsulation member 502from among areas of the substrate 501 of the display panel 410.

As a selective example, the intermediate member 520 may be arrangedbetween the covering member 590 and an area of the encapsulation member502, which is not covered by the bonding member 540 or the polarizationmember 530.

As a selective example, the intermediate member 520 may be arrangedbetween the covering member 590 and an area of the encapsulation member502, which is not covered by the bonding member 540 or the polarizationmember 530.

As a selective example, the intermediate member 520 may be arranged onan area where the display panel 510 is not bonded to the covering member590 from among areas disposed between the display panel 510 and thecovering member 590. More specifically, the intermediate member 520 maybe disposed on an area between the covering member 590 and the displaypanel 510 except for the area where the bonding member 540 is arranged.

The intermediate member 520 may be arranged in a space between thedisplay panel 510 and the covering member 590, and as a selectiveexample, the intermediate member 520 may fill the space between thedisplay panel 510 and the covering member 590.

The base material 521 and the heat transfer particles 522 of theintermediate member 520 may be the same as those described above, e.g.,base materials 121, 121′ and 121″ and heat transfer particles 122, 122′,122″, and 123″, and thus detailed descriptions thereof will be omitted.

Since the intermediate member 520 covers an area of the circuit member560 which corresponds to the substrate 501 from among areas of thecircuit member 560, the circuit member 560 may be stably connected tothe substrate 501. As a selective example, if the intermediate member520 is arranged to fill the space between the substrate 501 and thecovering member 590, the intermediate member 520 adheres to the circuitmember 560, and thus the durability of the circuit member 560 may beimproved.

Also, due to an operation of the circuit member 560, heat may begenerated by the circuit member 560. If the temperature of the circuitmember 560 exceeds a certain threshold, electrical properties of thecircuit member 560 may be degraded or electrical defects may occur. Theheat generated by the circuit member 560 may be effectively emittedthrough the heat transfer particles 522 of the intermediate member 520,and thus the electrical properties of the circuit member 560 may beimproved.

The intermediate member 520 may cover and protect the IC 550. Further,since the intermediate member 520 covers an area of the main circuitmember 555, which corresponds to the substrate 501 from among areas ofthe main circuit member 555, the main circuit member 555 may be stablyconnected to the substrate 501 and may maintain a stable electricalconnection to the IC 550.

Also, due to an operation of the display panel 510, heat may begenerated by the IC 550 and the main circuit member 555. If thetemperature of the IC 550 or the main circuit member 555 exceeds acertain threshold, electrical properties of the IC 550 and the maincircuit member 555 may be degraded or electrical defects may occur. Theheat generated by the IC 550 and the main circuit member 555 may beeffectively emitted through the heat transfer particles 522 of theintermediate member 520, and thus the electrical properties of the IC550 and the main circuit member 555 may be improved.

As shown in FIG. 12, the intermediate member 520 may be disposed suchthat the length of the intermediate member 520 along the Y direction isthe same as the length of an end portion of the substrate 501 along theY direction. Accordingly, the intermediate member 520 may correspond toa space between the substrate 501 and the covering member 590. Theintermediate member 520 may prevent unintentional separation of thesubstrate 501 and the covering member 590.

As described above, according to the one or more of the above exemplaryembodiments of the present invention, a display apparatus may haveimproved durability and electrical properties.

It should be understood that the exemplary embodiments described thereinshould be considered in a descriptive sense only and not for purposes oflimitation. Descriptions of features or aspects within each embodimentshould typically be considered as available for other similar featuresor aspects in other embodiments.

Although certain exemplary embodiments and implementations have beendescribed herein, other embodiments and modifications will be apparentfrom this description. Accordingly, the invention is not limited to suchembodiments, but rather to the broader scope of the presented claims andvarious obvious modifications and equivalent arrangements.

What is claimed is:
 1. A display apparatus comprising: a display panel;a covering member; a bonding member arranged between the display paneland the covering member; and an intermediate member having a differentcomposition than the bonding member and comprising a base materialcomprising an insulating material and a plurality of heat transferparticles, the intermediate member disposed between the display paneland the covering member, wherein: the display panel comprises: asubstrate; an encapsulation member which faces the substrate; and adisplay device arranged between the substrate and the encapsulationmember; the covering member is arranged to face the display panel; theintermediate member is disposed in a gap between the covering member andan area of the substrate where the encapsulation member is not disposed;the plurality of heat transfer particles comprise at least two particlesspaced apart from each other; the plurality of heat transfer particlescomprise at least a particle spaced apart from the substrate and atleast a particle spaced apart from the covering member; and theintermediate member is disposed to be non-overlapping with the bondingmember in a thickness direction.
 2. The display apparatus of claim 1,wherein the insulating material comprises an organic material.
 3. Thedisplay apparatus of claim 1, wherein the insulating material comprisesa resin-based material.
 4. The display apparatus of claim 1, wherein theintermediate member is arranged to contact sides of the bonding member.5. The display apparatus of claim 1, wherein the bonding member isarranged to correspond to a surface of the encapsulation member whichfaces the covering member.
 6. The display apparatus of claim 1, whereinthe intermediate member is disposed in a gap between the covering memberand an area of the encapsulation member.
 7. The display apparatus ofclaim 1, further comprising: an integrated circuit (IC) to transmit anelectric signal to the display device, the IC being disposed on asurface of the substrate which is not covered by the encapsulationmember; and a main circuit member which is electrically connected to theIC, wherein the intermediate member covers portions of the IC and themain circuit member, the portions of the IC and the main circuit memberbeing disposed within the gap between the covering member and the areaof the substrate where the encapsulation member is not disposed.
 8. Thedisplay apparatus of claim 1, wherein the intermediate member isarranged to contact sides of the encapsulation member.
 9. The displayapparatus of claim 1, wherein the display device comprises: an organiclight-emitting device comprising a first electrode, a second electrode,and an emission layer disposed between the first and second electrodes,wherein the organic light-emitting device is arranged between thesubstrate and the encapsulation layer.
 10. The display apparatus ofclaim 1, wherein the heat transfer particles comprise metals orcarbon-based materials.
 11. A display apparatus comprising: a displaypanel comprising one or more display devices to display an image to auser; a covering member arranged to face the display panel; a bondingmember to bond the display panel and the covering member, the bondingmember being arranged between the display panel and the covering member;and an intermediate member disposed in a gap between the display paneland the covering member, the intermediate member having a differentcomposition than the bonding member and comprising a base materialcomprising an insulating material and a plurality of heat transferparticles, wherein: the plurality of heat transfer particles comprise atleast two particles spaced apart from each other; the plurality of heattransfer particles comprise at least a particle spaced apart from thesubstrate and at least a particle spaced apart from the covering member;and the intermediate member is disposed to be non-overlapping with thebonding member in a thickness direction.
 12. The display apparatus ofclaim 11, wherein the insulating material comprises an organic material.13. The display apparatus of claim 11, wherein the display panelcomprises a substrate and an encapsulation member which faces thesubstrate, wherein the one or more display devices are arranged betweenthe substrate and the encapsulation member, and wherein the intermediatemember is disposed in a gap between the covering member and the displaypanel where the encapsulation member is not arranged.
 14. The displayapparatus of claim 11, wherein the intermediate member is arranged tocontact sides of the bonding member.
 15. The display apparatus of claim11, wherein the intermediate member is arranged to fill spaces in a gapbetween the display panel and the covering member.
 16. The displayapparatus of claim 11, wherein the one or more display devices comprisean organic light-emitting device or a liquid crystal display device. 17.The display apparatus of claim 11, wherein the heat transfer particlescomprise metals or carbon-based materials.